Axiom.

芯片数据库

移动 SoC

专注移动 SoC:制程、CPU/GPU 架构、AI、内存与连接能力。

制程看能效潜力

工艺节点只是起点,还要看架构、频率与负载。

CPU 看响应与吞吐

核心数不等于速度,单核和多核影响不同任务。

GPU 看架构与支持

结合图形架构、驱动与散热,理解持续游戏表现。

Snapdragon 8 Elite Gen 5

Qualcomm · Mobile SoC

制程
TSMC 3 nm
CPU
3rd-gen Oryon: 2 prime cores up to 4.6 GHz + 6 performance cores up to 3.62 GHz
GPU
Adreno 840; hardware ray tracing and mesh shading
查看芯片规格与架构

A19 Pro

Apple · Mobile SoC

制程
TSMC 3 nm (N3P)
CPU
6-core: 2 performance + 4 efficiency; up to 4.26 GHz
GPU
Apple GPU, 5- or 6-core configurations; hardware ray tracing
查看芯片规格与架构

A19

Apple · Mobile SoC

制程
TSMC 3 nm (N3P)
CPU
6-core: 2 performance + 4 efficiency; up to 4.26 GHz
GPU
Apple GPU, 4- or 5-core configurations; hardware ray tracing
查看芯片规格与架构

Tensor G5

Google · Mobile SoC

制程
TSMC 3 nm
CPU
1× Cortex-X4 3.78 GHz + 5× Cortex-A725 3.05 GHz + 2× Cortex-A520 2.25 GHz
GPU
Imagination PowerVR DXT-48-1536; published technical reference
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Dimensity 8400

MediaTek · Mobile SoC

制程
TSMC 4 nm
CPU
8× Cortex-A725: 1× 3.25 GHz + 3× 3.0 GHz + 4× 2.1 GHz
GPU
Arm Mali-G720 MC7
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Snapdragon 8 Elite

Qualcomm · Mobile SoC

制程
TSMC 3 nm
CPU
Oryon: 2 prime cores up to 4.32 GHz + 6 performance cores up to 3.53 GHz
GPU
Adreno GPU with hardware ray tracing and mesh shading
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Dimensity 9400

MediaTek · Mobile SoC

制程
TSMC second-generation 3 nm
CPU
1× Cortex-X925 up to 3.62 GHz + 3× Cortex-X4 + 4× Cortex-A720
GPU
12-core Arm Immortalis-G925 with hardware ray tracing
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A18

Apple · Mobile SoC

制程
TSMC 3 nm (N3E)
CPU
6-core: 2 performance + 4 efficiency; up to 4.04 GHz
GPU
Apple GPU, 4- or 5-core configurations; hardware ray tracing
查看芯片规格与架构

Tensor G4

Google · Mobile SoC

制程
Samsung 4 nm
CPU
1× Cortex-X4 3.1 GHz + 3× Cortex-A720 2.6 GHz + 4× Cortex-A520 1.92 GHz
GPU
Arm Mali-G715 MP7; published technical reference
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Dimensity 7300

MediaTek · Mobile SoC

制程
TSMC 4 nm
CPU
4× Cortex-A78 up to 2.5 GHz + 4× Cortex-A55
GPU
Arm Mali-G615
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Snapdragon 7+ Gen 3

Qualcomm · Mobile SoC

制程
TSMC 4 nm
CPU
1× Cortex-X4 up to 2.8 GHz + 4× Cortex-A720 + 3× Cortex-A520
GPU
Adreno GPU; Snapdragon Elite Gaming features
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Dimensity 8300

MediaTek · Mobile SoC

制程
TSMC 4 nm
CPU
4× Cortex-A715 up to 3.35 GHz + 4× Cortex-A510
GPU
Arm Mali-G615 MC6
查看芯片规格与架构

Snapdragon 7 Gen 3

Qualcomm · Mobile SoC

制程
TSMC 4 nm
CPU
1× Cortex-A715 up to 2.63 GHz + 3× Cortex-A715 up to 2.4 GHz + 4× Cortex-A510
GPU
Adreno 720
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Dimensity 9300

MediaTek · Mobile SoC

制程
TSMC 4 nm
CPU
1× Cortex-X4 3.25 GHz + 3× Cortex-X4 2.85 GHz + 4× Cortex-A720 2.0 GHz
GPU
Arm Immortalis-G720 MC12 with hardware ray tracing
查看芯片规格与架构

Snapdragon 8 Gen 3

Qualcomm · Mobile SoC

制程
TSMC 4 nm
CPU
1× Cortex-X4 up to 3.3 GHz + 5× Cortex-A720-class + 2× Cortex-A520
GPU
Adreno GPU with hardware ray tracing and mesh shading
查看芯片规格与架构

Exynos 2400

Samsung · Mobile SoC

制程
Samsung 4LPP+
CPU
1× Cortex-X4 3.2 GHz + 2× Cortex-A720 2.9 GHz + 3× Cortex-A720 2.6 GHz + 4× Cortex-A520 2.0 GHz
GPU
Xclipse 940 based on AMD RDNA 3; hardware ray tracing
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A17 Pro

Apple · Mobile SoC

制程
TSMC 3 nm (N3)
CPU
6-core: 2 performance + 4 efficiency; up to 3.78 GHz
GPU
Apple GPU, 5- or 6-core configurations; hardware ray tracing
查看芯片规格与架构

Snapdragon 4 Gen 2

Qualcomm · Mobile SoC

制程
Samsung 4 nm
CPU
2× Cortex-A78 up to 2.2 GHz + 6× Cortex-A55
GPU
Adreno GPU; exact model is not publicly named
查看芯片规格与架构

Snapdragon 8 Gen 2

Qualcomm · Mobile SoC

制程
TSMC 4 nm
CPU
1× Cortex-X3 up to 3.2 GHz + 2× Cortex-A715 + 2× Cortex-A710 + 3× Cortex-A510
GPU
Adreno GPU with hardware ray tracing
查看芯片规格与架构

Snapdragon 6 Gen 1

Qualcomm · Mobile SoC

制程
Samsung 4 nm
CPU
4× Cortex-A78 up to 2.2 GHz + 4× Cortex-A55
GPU
Adreno GPU; exact model is not publicly named
查看芯片规格与架构

Snapdragon 8 Gen 1

Qualcomm · Mobile SoC

制程
Samsung 4 nm
CPU
1× Cortex-X2 up to 3.0 GHz + 3× Cortex-A710 + 4× Cortex-A510
GPU
Adreno 730; Vulkan and variable-rate shading
查看芯片规格与架构

共 21 个移动 SoC,当前显示 21 个 · 数据更新于 2026 年 10 月 5 日